Our Product Types
Delivery/lead time: 15 days
Delivery/lead time: 20 days
Delivery/lead time: 25 days
Delivery/lead time: > 25 days
Faster times are possible upon request.
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SMT delivery/lead time: 5 days
How we work
We meet our clients face-to-face prior to each project at concept stage and conduct a thorough review through our Early Supplier Involvement (ESI) program. Once we have a clear understanding of each client’s needs and goals, we create a customized approach for their specific project.
While checking in on a regular basis throughout the project, we also meet face-to-face with clients at the mid- and post-project stages in order to continually measure our performance and gain constructive feedback. This feedback is communicated back to the project team so they can modify their approach, if necessary, or retain it as a lesson learned for future projects.
|Line / Space (min)||25/25μm|
|Conductor width tolerance||+/-20%|
|Microvias / Pads diameter (min)||50/100μm|
|Blind / Buried vias|
|Soldermask web (min)||50μm|
|Soldermask registration tolerance||+/-35μm|
|Flex||up to 10 layers|
|Rigid-Flex||up to 10 layers|
|Electrolytic Ni / Hard Au|
|Electrolytic Ni / Soft Au|
|BGA encapsulation / underfill|
|100% In-line AOI|
|100% In-line BGA X-Ray|