Our Product Types
Single-sided FPC
Delivery/lead time: 15 days
Double-sided FPC
Delivery/lead time: 20 days
Multi-layer FPC
Delivery/lead time: 25 days
Rigid-flex FPC
Delivery/lead time: > 25 days
Faster times are possible upon request.
Services
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Research &Development
Cost-Application-Design optimisation
Circuit design
Sourcing ofComponents,
plastic,rubber,
metal, cable
Prototyping,testing
& validation
Turnkey Assembly,modular build,
box build
SMT delivery/lead time: 5 days
How we work
We meet our clients face-to-face prior to each project at concept stage and conduct a thorough review through our Early Supplier Involvement (ESI) program. Once we have a clear understanding of each client’s needs and goals, we create a customized approach for their specific project.
ESI Program
While checking in on a regular basis throughout the project, we also meet face-to-face with clients at the mid- and post-project stages in order to continually measure our performance and gain constructive feedback. This feedback is communicated back to the project team so they can modify their approach, if necessary, or retain it as a lesson learned for future projects.
Technical specifications
| Flex Technologies | |
|---|---|
| Line / Space (min) | 25/25μm |
| Conductor width tolerance | +/-20% |
| Microvias / Pads diameter (min) | 50/100μm |
| Blind / Buried vias | |
| Filled via | >75% |
| Soldermask web (min) | 50μm |
| Soldermask registration tolerance | +/-35μm |
| Layer counts | |
| Flex | up to 10 layers |
| Rigid-Flex | up to 10 layers |
| Finishings | |
| ENIG | |
| Electrolytic Ni / Hard Au | |
| Electrolytic Ni / Soft Au | |
| ENEPIG | |
| OSP | |
| Others | Electrolytic Sn |
| Assembly | |
|---|---|
| Passive component | Others |
| Connector pitch | 0.20mm |
| BGA Pitch | 0.20mm |
| BGA encapsulation / underfill | |
| 100% In-line AOI | |
| 100% In-line BGA X-Ray | |
