Products & Services

We specialize in providing design & application solutions for flexible printed circuit (FCP) boards.

Products Services

Contact Us

For a quotation and general inquiries. We aim to answer
within 24 hours.

Our Product Types

Single-sided FPC

Single-sided FPC

Delivery/lead time: 15 days

Double-sided FPC

Double-sided FPC

Delivery/lead time: 20 days

Multi-layer FPC

Multi-layer FPC

Delivery/lead time: 25 days

Rigid-flex FPC

Rigid-flex FPC

Delivery/lead time: > 25 days

Faster times are possible upon request.

Services

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Research & Development Research &
Development
Cost-Application-Design optimisation Cost-Application
-Design optimisation
Circuit design Circuit design
Sourcing of Components Sourcing of
Components,
plastic,rubber,
metal, cable
Prototyping, testing & validation Prototyping,
testing
& validation
Turnkey Assembly Turnkey Assembly,
modular build,
box build

SMT delivery/lead time: 5 days

How we work

We meet our clients face-to-face prior to each project at concept stage and conduct a thorough review through our Early Supplier Involvement (ESI) program. Once we have a clear understanding of each client’s needs and goals, we create a customized approach for their specific project.

ESI Program

While checking in on a regular basis throughout the project, we also meet face-to-face with clients at the mid- and post-project stages in order to continually measure our performance and gain constructive feedback. This feedback is communicated back to the project team so they can modify their approach, if necessary, or retain it as a lesson learned for future projects.

Technical specifications

Flex Technologies
Line / Space (min) 25/25μm
Conductor width tolerance +/-20%
Microvias / Pads diameter (min) 50/100μm
Blind / Buried vias
Filled via >75%
Soldermask web (min) 50μm
Soldermask registration tolerance +/-35μm
Layer counts
Flex up to 10 layers
Rigid-Flex up to 10 layers
Finishings
ENIG
Electrolytic Ni / Hard Au
Electrolytic Ni / Soft Au
ENEPIG
OSP
Others Electrolytic Sn
Assembly
Passive component Others
Connector pitch 0.20mm
BGA Pitch 0.20mm
BGA encapsulation / underfill
100% In-line AOI
100% In-line BGA X-Ray

Awards & Certifications

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