Products & Services

A showcase of what Topsun Electronic has to offer

PRODUCT SOLUTIONS

Our Product Types


Single-sided FPC
Double-sided FPC
Multi-layer FPC
Rigid-flex FPC

Our Key Applications


  • ▸ Display for Mobile
  • ▸ Smartphone & Tablet
  • ▸ Touch Screen & Camera Module
  • ▸ Optical Pickup Unit
  • ▸ Automotive Display
  • ▸ Medical Devices


EQUIPMENT TECHNOLOGY

  • ▸ Production
  • ▸ In-Process Quality Control
  • ▸ Reliability Test


CNC Drilling
Laser Drilling
Automatic Exposure
DES
Auto Stiffener Bonding
Finishing - ENEPIG
PTH
Vertical Copper Plating
Lamination Press
Plasma Clean
Outline Punching
Surface Mount Technology
AOI
Flying Probe Tester
Impedance Tester
Solder Paste Inspection
3D X-Ray
SMT AOI
Thermal Cycling Tester
Humidity Chamber
RoHS Analyzer
Salt Spray Tester
Solderability Tester
High Speed Bending Tester

MANUFACTURING CAPABILITIES

Flex Technologies
No. Description Measurement
1 Line / Space (min) 50/50μm
2 Conductor width tolerance +/-20%
3 Microvias / Pads diameter (min) 100/250μm
4 Blind / Buried vias
5 Filled via >75%
6 Soldermask web (min) 50μm
7 Soldermask registration tolerance +/-35μm
8 Layer counts
i. Flex up to 10 layers
ii. Rigid-Flex up to 10 layers
9 Finishings
i. ENIG
ii. Electrolytic Ni / Hard Au
iii. Electrolytic Ni / Soft Au
iv. ENEPIG
v. OSP
vi. Others Electrolytic Sn


Assembly
No. Description Measurement
1 Passive component 01005 chip
2 Connector pitch 0.20mm
3 BGA Pitch 0.20mm
4 BGA encapsulation / underfill
5 100% In-line AOI
6 100% In-line BGA X-Ray